HiSiliconhi3516ev200+imx307Development Board
Project: Board Introduction | page_id: 871
| 3516ev200+imx307 Module | |
|---|---|
| Model | XSWTVR-1CE16V200/EX |
| CPU | HI3516EV200 |
| Video Encoding | Supports H.265/H.264 encoding/decoding, maximum resolution 1920x1080@30fps |
| Audio Input | Sampling rate: 8K/12K/16K/24K/32K/44.1K/48K |
| Audio Output | Supported |
| Storage | SPI nor 128Mbit flash |
| USB | USB 2.0 |
| Network | RJ45 10/100M |
| Operating Temperature | 0 to 70℃ |
| Service Life | Continuous operation life of more than 2 years |
I. Product Images

II. CPU Parameters
Description
Hi3516EV200 is a new generation HD IP camera SOC dedicated to the industry. It integrates a new generation ISP and the industry's latest H265 video compression encoder, and adopts advanced low-power process and low-power architecture design, making Hi3516EV200 lead the industry in low bitrate, high image quality and low power consumption. It integrates POR, RTC and Audio Codec, greatly reducing the ebom cost for customers. And with an interface design similar to that of Shanghai HiSilicon DVR/NVR chips, it can conveniently support customers' product development and mass production.
• Integrated new generation ISP
• The latest H265 video compression encoder, low bitrate, high image quality
• Integrated POR, RTC, Audio Codec
Features
Processor Core
• ARM Cortex A7@ 900MHz,32KB I-Cache, 32KB D-Cache /128KB L2 cache
• Supports Neon acceleration, integrated FPU processing unit
Video Encoding
• H.264 BP/MP/HP,supports I/P frames
• H.265 Main Profile,supports I/P frames
• MJPEG/JPEG Baseline encoding
Video Encoding Processing Performance
• H.264/H.264 encoding supports a maximum resolution of 2304x1296, with a maximum width of 2304
• H.264/H.265 multi-stream real-time encoding capability:
− 2048x1536@20fps+720x576@20fps
− 2304x1296@20fps+720x576@20fps
− 1920x1080@30fps+720x576@30fps
• Supports JPEG capture 3M(2304x1296)@5fps
• Supports six bitrate control modes: CBR/VBR/FIXQP/AVBR/QPMAP/CVBR
• Supports smart encoding mode
• Output bitrate up to 60Mbps
• Supports encoding of 8 regions of interest (ROI)
Intelligent Video Analytics
• Integrated IVE intelligent analysis acceleration engine
• Supports intelligent motion detection, perimeter protection, video diagnosis and other intelligent analysis applications
Video and Graphics Processing
• Supports 3D denoising, image enhancement, dynamic contrast enhancement
• Supports anti-flicker processing for video and graphics output
• Supports video and graphics 1/15~16x scaling
• Supports video and graphics overlay
• Supports image 90, 180, 270 degree rotation
• Supports image Mirror and Flip
• OSD overlay for 8 regions before encoding
ISP
• Supports 4x4 Pattern RGB-IR sensor
• 3A(AE/AWB/AF),supports third-party 3A algorithms
• Fixed pattern noise removal, bad pixel correction
• Lens shading correction, lens distortion correction, purple fringing correction
• Direction-adaptive demosaic
• gamma correction, dynamic contrast enhancement, color management and enhancement
• Region-adaptive defog
• Multi-level noise reduction (BayerNR, 3DNR) and sharpening enhancement
• Local Tone mapping
• Sensor Built-in WDR
• 2F-WDR frame mode
• Digital image stabilization
• Supports intelligent ISP adjustment, provides PC-side ISP tuning tools
Audio Codec
• Multi-protocol voice codec implemented by software
• Protocols supported: G.711、G.726、ADPCM
• Supports audio 3A(AEC、ANR、AGC)functions
Security Engine
• Hardware implementation of AES/RSA encryption and decryption algorithms
• Hardware implementation of HASH(SHA1/SHA256/HMAC_SHA1/HMAC_ SHA256)
• Internally integrated 32Kbit one-time programmable space and random number generator
Video Interface
• Input
− Supports 8/10/12bit RGB Bayer DC timing video input
− Supports MIPI, LVDS/Sub-LVDS, HiSPi interfaces
− Supports connection with mainstream HD CMOS sensors from SONY, ON, OmniVision, Panasonic, etc.
− Compatible with various sensor parallel/differential interface electrical characteristics
− Provides programmable sensor clock output
− Supports a maximum input resolution of 2304x1296
• Output
− Supports 6/8bit LCD output
− Supports BT656/BT1120 output
Audio Interface
• Integrated Audio codec, supports 16bit voice input and output
• Supports mono mic/line in input
• Supports mono line out output
• Supports I2S interface, supports connection with an external Audio codec
Peripheral Interfaces
• Supports POR
• Integrated high-precision RTC
• Integrated 2-channel LSADC
• 3 UART interfaces
• Supports I2C, SPI, GPIO and other interfaces
• 4 PWM interfaces
• 1 SDIO2.0 + 1 SD card 2.0
• 1 USB 2.0 HOST/Device interface
• Integrated FE PHY; supports TSO network acceleration
External Memory Interface
• SDRAM interface
− Built-in 512Mb DDR2
• SPI NOR Flash interface
− Supports 1, 2, 4-wire modes
− Maximum capacity supported 256MB
• SPI NAND Flash interface
− Supports 1, 2, 4-wire modes
− Maximum capacity supported 1GB
• eMMC4.5 interface
− 4bit data width
Boot
• Can boot from SPI NOR Flash, SPI NAND Flash or eMMC
• Supports secure boot
SDK
• Provides SDK packages based on HUAWEI LiteOS/Linux-4.9
• Provides a high-performance H.264 PC decoding library
• Provides high-performance H.265 PC, Android, iOS decoding
Chip Physical Specifications
• Power consumption
− 1080P30/3M20 scenario, 700mW typical power consumption
• Operating voltage
− Core voltage 0.9V − IO voltage 3.3V(+/-10%)
− SDRAM interface voltage 1.8V
• Package
− 9mm x 9mm,88pin 0.35mm pin pitch,QFN package
III. IMX307 Sensor Parameters
| 2MP Camera | |||
|---|---|---|---|
| Camera | Main Chip | HiSilicon hi3516ev200 | |
| Sensor Type | IMX307 1/2.8'' CMOS Solid-state Image Sensor | ||
| Lens | 2.8mm~6mm: F1.6 horizontal field of view 79°~51° | ||
| Minimum Illumination | Color:0.001 Lux@(F1.2,AGC ON);B/W:0.0003Lux @(F1.2,AGC ON),0 Lux with IR | ||
| Lens Interface Type | M20 | ||
| Shutter | 1 second to 1/100.000 second | ||
| Day/Night Switching Mode | ICR infrared cut filter | ||
| Video Processing | 3A(AE,AF,and AWB)funciton | ||
| Compression Standard | Video Compression Standard | H.264 /H.264 /MJPEG | |
| H.265 Encoding Type | Main Profile | ||
| H.264 Encoding Type | BaseLine Profile /Main Profil /High Profile | ||
| Video Compression Bitrate | 32Kbps~8Mbps | ||
| Image | Max Image Size | 1920x1980 | |
| Main Stream Resolution and Frame Rate | 1920x1080@30hz,1280x720@60hz | ||
| Sub Stream Resolution and Frame Rate | 704x480@60hz 640x480@60hz | ||
| Highlight Suppression | Supported | ||
| Electronic Image Stabilization | Supported | ||
| Defog | Supported | ||
| Day/Night Switching Mode | Day, night, auto | ||
| OSD | Supports PNG image overlay | ||
| AI Function | Motion Detection | Through the 4x4 pixel motion detection function of the HiSilicon chip, combined with the intelligent analysis thrown-object algorithm, using the background modeling algorithm based on 4x4 pixels to determine whether the pixel has changed | |
| High-Altitude Thrown Object Detection | By judging the moving direction of the object, it identifies high-altitude thrown object behavior and performs emergency video saving | ||
| Alarm Function | Supports linkage with the platform to send alarm information | ||
| Network Function | Interface Protocol | ONVIF | |
| Security Protocol | Password protection | ||
| Network Protocol | TCP/IP,HTTP,FTP,DHCP,DNS,RTP,RTSP,RTMP | ||
| Remote Management | Supports remote web management | ||
| Storage Function | Supports standard Micro SD/Micro SDHC up to 128G local storage | ||
| Interface | Communication Interface | 1 10M/100M adaptive RJ45 Ethernet port | |
| Audio Interface | 1 pair of audio input and output (1 channel line in/out) | ||
| 4G Module (Optional) | Supported Wireless Bands | LTE-TDD : B34/B38/B39/B40/B41 | |
| LTE-FDD : B1/B3/B5/B8 | |||
| TD-SCDMA: B34/B39 | |||
| WCDMA: B1/B8 | |||
| CDMA: BC0 | |||
| GSM: 900/1800MHZ | |||
| General Specifications | Power Supply | DC12V | |
| Operating Temperature | -20℃~80℃ | ||
| Operating Humidity | Humidity less than 95% (non-condensing) | ||
| Protection Level | IP66 | ||
| Dimensions(mm) | Bullet:83x76x159 Dome:117x100 | ||
| Weight | Bullet:370g Dome:230g |
IV. Hardware Interface Diagram
(1) power

(2)IRCUT

(3) audio input, audio output, USB interface

(4) uart debugging

(5)tf card

V. Device FAQ
| Question | Answer |
|---|---|
| 1、Can a 4G module and a WiFi module be connected? | 4G and WiFi modules can be connected via USB |
| 2、Is the 3A algorithm supported? | Yes, supported |
| 3、Does it support camera recording? | 1 channel supported |
| 3、Can the LiteOS operating system be debugged? | The LiteOS system can be debugged |
| 4、Does the development board support LiteOS? | We have only run Linux. An SDK is provided for LiteOS to compile images, but no support is provided |
| 5、Is a schematic included? | No, the schematic is charged separately. The schematic is 2000 CNY for the PDF version; the full set of schematic + PCB source files is 15000 CNY |
| 6、Are contrast, saturation and brightness adjustment functions supported? | Yes, there are APIs in the SDK to adjust them |
| 7、Does the HiSilicon 3516ev200 board support deploying wk models? | Not supported |
| 8、Can YOLOv5 be deployed for object detection? | No, but hi3516ev300 can |
| 9、Are all the components on the board domestically produced? | No. An all-domestic version requires customization |
| 10、Is 1080P 30fps stream output supported? | Yes, supported |
| 11、Can the device be connected to the cloud? To Huawei Cloud | No |
| 12、Can only the himix200 cross-compilation toolchain be used when compiling? | Yes |
| 13、 |