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From idea to volume, one team all the way

A 15-year embedded team with in-house board capability across six chip platforms. No subcontracting — solution, prototype, certification and production by the same team throughout.

Why customize with us
Board R&D years15
Chip PlatformsHiSilicon / Ingenic / Rockchip / Goke / ECC
Own product lines6 lines / 100+ models
Full-product ODM casesSmart Pet Feeder
HW + SW + App + Cloud — a complete product
SERVICES

Six engagement models

SERVICE 01

ODM Full-Product Customization

Your category, we build it

  • In-house structure + mainboard + firmware
  • Flagship case: smart pet feeder
  • App + cloud platform included
SERVICE 02

OEM / PCBA Branding

Rebrand existing lines & hardware changes

  • All six lines can be branded
  • Logo / silkscreen / packaging
  • Branded firmware flashing
SERVICE 03

Algorithm Customization

Turn your scenario into detection capability

  • Lightweight NPU model training
  • Existing helmet/fire/perimeter library
  • HTTP alert integration
SERVICE 04

Source Code Delivery

Buy out platform code — full control

  • Streaming platform / admin source
  • Deployment docs + training
  • Optional long-term support
SERVICE 05

Solution Consulting

One hour on selection & architecture

  • Protocol / channel / chip selection
  • System architecture review
  • Feasibility report
SERVICE 06

Small-Batch Pilot

From 10 units — validate before scaling

  • Prototype / tooling / SMT
  • Burn-in & reliability testing
  • Pilot issue closure
PROCESS

Five-step customization process

STEP 01

Requirements

we reply within 1 business day
Define the scenario and targets

STEP 02

Proposal & Quote

Architecture diagram + BOM
Lead time and cost estimate

STEP 03

Prototype

Schematics / Mechanics / Firmware
Stage-wise prototype sign-off

STEP 04

Testing & Finalize

Reliability testing
Certification support

STEP 05

Volume Delivery

Mass production ramp-up
Ongoing technical support

CAPABILITY

Four in-house layers — no choke points

LAYER 01 · Chip LayerBoard-level development on HiSilicon/Rockchip/Ingenic/Goke/EEasyTech, schematics & drivers in-house
LAYER 02 · Device LayerEncoder / AI box / live streamer design & firmware
LAYER 03 · Platform LayerStreaming servers / GB28181 / WebRTC P2P on-premise
LAYER 04 · Application LayerAI gateway / mini-programs / App / IoT cloud — complete products

Send us your requirements

Describe your scenario in a paragraph — we return a solution outline and quote range within 1 business day

Submit custom requirements

Request a Quote

Fill in the form and we will get back with a quote and proposal within 1 business day.

Click "Generate inquiry email" to open your mail client with the body pre-filled. If no mail client is configured, click "Copy" and paste it into webmail — recipient: sunshiyang@xstrive.com.