HiSiliconhi3519AV100 AI Board

Project: Board Introduction | page_id: 881

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Product Images

CPU Specifications

Description
Hi3519AV100 is a high-performance, low-power 4K Smart Camera SoC launched for surveillance IP cameras, sports cameras, panoramic cameras, rear-view mirrors, aerial drones and other product fields. The chip supports H.265/H.264 encoding/decoding, with encoding/decoding performance up to 4K*2K@60fps / 1080p@240fps. It integrates HiSilicon's 4th generation ISP, supporting WDR, multi-level noise reduction, 6-axis anti-shake and a variety of image enhancement and correction algorithms, delivering professional-grade image quality for customers. At the same time, the chip also supports 4K RAW data output, which can be used for post-production editing. Built on an advanced 12nm low-power process and low-power architecture design, it simplifies the thermal design of customer products and helps customers build energy-saving and environmentally friendly smart camera products.

• Integrates a new-generation ISP, supporting 2-channel and 4-channel panoramic stitching

• Supports WDR, multi-level noise reduction and 6-axis anti-shake

• Integrates a high-performance NNIE engine with 2Tops computing power

Features
Processor Core
• 2*ARM Cortex A53@1.5GHz, 32KB I-cache, 32KB D-cache / 256KB L2 cache
• Supports Neon acceleration, integrated FPU processing unit

DSP
• Integrated Tensilica Vision P6 DSP@710MHz
• 32KB I-Cache / 32KB I-RAM / 512KB Data RAM
• 0.3Tops neural network computing performance
• Supports HUAWEI LiteOS

NNIE
• Supports AlexNet, VGG, ResNet, GoogLeNet and other classification neural networks
• Supports Faster R-CNN, SSD, YoloV2 and other object detection neural networks
• 1.7Tops neural network computing performance
• Supports a complete API and toolchain (compiler, simulator), easy to adapt to customer custom networks

Video Encoding/Decoding
• H.265 Main Profile, level 5.1
• H.264 Baseline/Main/High Profile, level 5.1
• H.265/H.264 supports I/P/B slice
• Supports JPEG Baseline
• H.265/H.264 max codec resolution: 8192 x 8192
• H.265/H.264 codec performance:
− 3840 x 2160@60fps + 720p@30fps encoding
− 3840 x 2160@60fps decoding
− 3840 x 2160@30fps encoding + 3840 x 2160@30fps decoding
• JPEG max codec resolution: 8192 x 8192
• JPEG max codec performance: 16M (4608 x 3456)@30fps
• Supports CBR/VBR/AVBR/FIXQP/QPMAP and other rate control modes
• H.265/H.264 max encoding output bitrate: 120Mbps / 200Mbps respectively
• Supports 8 regions of interest (ROI) encoding

Video Input Interface
• Supports 12-lane image sensor serial input, supporting MIPI/subLVDS/HiSPI/SLVS-EC interfaces
• Supports up to 5 sensor serial inputs, supporting 12-lane / 8-lane+4-lane / 4-lane+4x2-lane combinations
• Max input resolution: 7680x4320
• Supports 10/12/14 bit Bayer RGB DC timing video input
• Supports BT.656, BT.1120 video input; supports 1~4 channels of YUV input via MIPI virtual channels
ISP and Image Processing
• The ISP supports multi-channel time-division multiplexing and can process video from multiple sensor inputs
• Supports 3A (AE/AWB/AF); 3A parameters are user adjustable
• Supports fixed pattern noise (FPN) removal
• Supports two-frame exposure WDR and Local Tone Mapping; supports highlight suppression and backlight compensation
• Supports defective pixel correction and lens shading correction
• Supports multi-level 3D denoise, delivering excellent low-light image quality, removing motion smear and color noise
• Supports 3D-LUT color adjustment
• Supports image dynamic contrast enhancement and edge enhancement
• Supports chromatic aberration correction (CAC) and purple fringing removal
• Supports defog
• Supports 6-Dof digital image stabilization and rolling-shutter correction
• Supports lens distortion geometric correction and fisheye correction
• Supports image 90°/270° rotation
• Supports image mirror and flip
• Supports multi-channel scaled output, scaling factor: 1/15.5～16x
• Supports up to 8 regions of pre-encoding OSD overlay
• Provides PC-side ISP tuning tools

2D Graphics Processing
• Supports bitBLT operations
• Supports line drawing operations
• Supports alpha blending
• Supports color key
• Supports color space conversion

Video Stitching Hardware Acceleration Engine
• Supports 2-channel and 4-channel panoramic stitching
• Stitching performance:
− Input 2 channels 3000 x 3000@30fps, output 3840 x 2160@30fps
− Input 4 channels 1080 x 1920@30fps, output 3840 x 2160@30fps

Video Output Interface
• Supports HDMI 2.0 interface, up to 4K x 2K (4096 x 2160)@60fps output
• Supports 4-lane MIPI DSI interface, up to 1080p@60fps output
• Supports 6/8/16/24bit digital LCD/BT.656/BT.1120 interface, up to 1080p@60fps RGB/YUV data output
• Supports 2 independent HD video output channels (DHD0, DHD1):
− Supports non-synchronous display on any two interfaces
− DHD0 supports 36-window split
− DHD1 supports 16-window split
• Supports 1 PIP layer, which can be overlaid on DHD0 or DHD1
• Supports 2 full-screen GUI graphics layers in ARGB1555 or ARGB8888, for DHD0 and DHD1 respectively
• Supports 1 hardware cursor layer, format configurable as ARGB1555 or ARGB8888, max resolution 256x256
• Supports 1 scaling write-back channel

CV Hardware Acceleration Engine
• Supports hardware acceleration for binocular depth map computing, processing performance: 720p@30fps
• Supports IVE 2.1 intelligent operators, with hardware acceleration for feature point detection, optical flow, computer morphology processing and other operators

Audio Interface
• Integrated audio codec, supporting 16bit voice input and output
• Supports dual-channel Mic single-ended or differential input to reduce the noise floor
• Supports I2S interface, supporting 8-channel audio time-division multiplexed input and dual-channel audio output (mutually exclusive with the built-in audio codec)
• Supports HDMI audio output

Audio Encoding/Decoding
• Multi-protocol voice codec implemented in software
• Supports G.711/G.726/AAC and other audio encoding formats
• Supports audio VQE processing

Network Interface
• 1 Gigabit Ethernet interface
− Supports RGMII and RMII interface modes
− Supports 10/100Mbit/s half-duplex or full-duplex
− Supports 1000Mbit/s full-duplex
− Supports TSO to reduce CPU overhead

Security Engine
• Hardware implementation of AES/DES/3DES encryption/decryption algorithms
• Hardware implementation of RSA1024/2048/3072/4096 signature verification algorithms
• Hardware implementation of HASH anti-tampering algorithms, supporting HASH SHA1/224/256/384/512 and HMAC_SHA1/224/256/384/512 algorithms
• Built-in 32Kbit OTP storage space and hardware true random number generator
• Supports secure boot
• Supports memory/IO security isolation

Peripheral Interfaces
• 2 SDIO3.0 interfaces, of which
− SDIO0 supports SDXC cards
− SDIO1 supports connecting a WiFi module
• 1 USB3.0/PCIe 2.0 multiplexed interface
− Can be configured as USB3.0 only or PCIe 2.0 x1 + USB2.0
− When used as a PCIe 2.0 interface, supports RC and EP modes
− When used as a USB3.0 interface, supports configurable USB Host/Device
• 1 USB2.0 interface, configurable as Host/Device
• Supports internal POR (power-on reset) signal output, and also supports external reset input
• Supports internal RTC, which can be independently powered by a battery
• Integrated 4-channel LSADC
• 9 UART interfaces (some pins are multiplexed with other pins)
• Supports multiple I2C interfaces, SPI interfaces and GPIO interfaces
• 1 IR interface
• 8 PWM interfaces (some pins are multiplexed with other pins)

External Memory Interfaces
• 32bit DDR4/LPDDR4 interface
− DDR4/LPDDR4 max clock frequency 1333MHz
− DDR address space up to 3.5GB
• SPI NOR Flash interface
− Supports 1/2/4-wire modes
− Supports 3Byte and 4Byte address modes
− Max supported capacity: 256MB
• SPI NAND Flash interface
− Supports SLC Flash
− Supports 2KB/4KB page size
− Supports 8/24bit ECC (ECC per 1KB)
− Max supported capacity: 1GB
• NAND Flash interface
− 8bit data width
− Supports SLC Flash
− Supports 2KB/4KB page size
− Supports 8/16/24 bit ECC (ECC per 1KB)
− Max supported capacity: 1GB
• Supports eMMC5.1 interface
− Supports HS400
− Max supported capacity 2TB
Multiple Configurable Boot Modes
• Supports booting from BOOTROM
• Supports booting from SPI NOR flash
• Supports booting from SPI NAND flash
• Supports booting from NAND Flash
• Supports booting from eMMC
Supports Multiple Image Flashing Modes
• Supports image flashing via UART0
• Supports image flashing via SD card
• Supports image flashing via USB device

SDK
• Supports Linux SMP
• Provides high-performance H.265 decoding libraries for iOS/Android

Chip Physical Specifications
• Power consumption
− Typical scenario (4K x 2K (3840 x 2160)@30fps encoding + deep learning intelligent algorithm) power consumption: 2.2W
− Supports multi-level power saving modes
• Operating voltage
− Core voltage 0.8V
− IO voltage 1.8V/3.3V
− DDR4 SDRAM interface voltage 1.2V
− LPDDR4 interface voltage 1.1V
• Package
− RoHS, FCCSP
− 15mm x 15mm package size
− Pin pitch: 0.65/0.4mm mixed pitch
− Operating temperature: 0°C~70°C