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RK3588 Dual GigabitAIInferenceBoard

Dev Boards & Modules · Rockchip

Project: Board Introduction | page_id: 907

RK3588 Dual-Gigabit AI Board
Model	XSWTVR-2GBERK3588/T
CPU	RK3588
Video Encoding	Supports H.265/H.264 encoding/decoding, max resolution 7680x3840@60fps
Video Input	Network video stream, max 8K@60fps video, 4K@60 HDMI in
Video Output	VGA, HDMI
Interfaces	USB3.0 x1, USB2.0 x2
DDR	8GB
Storage	eMMC 5.1 16GB
Network	2 RJ45 10/100/1000M
Operating Temperature	0 to 70℃
Service Life	Continuous operation lifespan of more than 5 years

Board size: 195*153mm

1. RK3588 Core Board Documentation (Main Controller RK3588/DDR/EMMC)

1. Rockchip-RK3588

Description

• 8nm advanced process, 8-core 64-bit architecture, high performance, low power consumption
• ARM Mali-G610 MC4 GPU, dedicated 2D graphics acceleration module
• 6TOPs AI NPU, empowering various AI scenarios
• 8K video encoding/decoding, 8K display output
• Multiple built-in display interfaces, supports multi-screen different display
• Powerful image processing capability, 48MP ISP, supports multi-camera input
• Rich high-speed interfaces (PCIe, TYPE-C, SATA, Gigabit Ethernet), easy to expand
• Android and Linux OS
Features

CPU
• Octa-core 64-bit big.LITTLE architecture, 4Cortex-A76 + 4Cortex-A55
GPU
• ARM Mali-G610 MC4
• OpenGL ES 1.1/2.0/3.1/3.2
• Vulkan 1.1，1.2
• OpenCL 1.1,1.2,2.0
• Embedded high-performance 2D image acceleration module
NPU
• 6TOPS AI computing power, triple-core architecture, supports int4/int8/int16/FP16/BF16/TF32
Multimedia
• Supports H.265/H.264/AV1/VP9/AVS2 video decoding, up to 8K60FPS
• Supports H.264/H.265 video encoding, up to 8K30FPS
Display
• Supports eDP/DP/HDMI2.1/MIPI and other display interfaces
• Supports multi-screen different display, up to 8K60FPS
Video Input
• 32MP ISP, supports HDR and 3DNR
• Supports multi-camera input (44lanes or 42lanes+2*4Lanes) MIPI CSI-2 and DVP interfaces
• Supports HDMI2.0 input, up to 4K60FPS
High-Speed Interfaces
• Supports PCIe3.0/PCIe2.0/SATA3.0/RGMII/TYPE-C/USB3.1/USB2.0

2. DDR

Capacity
32 Gb

Architecture
x32

Speed
4266 Mbps

Operating Voltage
1.8 / 1.1 / 1.1 V

Operating Temperature
-40 ~ 125 °C

Package
200FBGA

Product Status
Mass Production

3. EMMC

Features

• Consistent Optimal Speed
• High Performance at Low Power
• Extensive Lineup, Quick Response

Version
eMMC 5.1

Density
16GB

Voltage
1.8 / 3.3 V

Interface
HS400

Package Size
11.5 x 13 x 0.8 mm

Temp.
-25 ~ 85 °C

Product Status
Mass Production

2. Interface Circuit Diagrams

12V power supply

VGA interface

USB3.0 flashing interface

HDMI loop-out

HDMI loop-in

Line

Gigabit RJ45-0

Gigabit RJ45-1

USB2.0_HOST*2

USB2.0_HOST1

Reset

EDP_LCD

DEBUG

UART to 485

SCREEN CONTROL INTERFACE

WiFi antenna interface

SATA2

SATA0

SATA1

SATA Power1

SATA Power2

UART to 232

FAN

LVDS INTERFACE

RTC